INTERNATIONAL PATENT: NTT RESEARCH, INC., TECHNISCHE UNIVERSITAT MUNCHEN FILES APPLICATION FOR "A METHOD FOR MANUFACTURING A MICROELECTRODE ARRAY STRUCTURE BY A FUSED FILAMENT FABRICATION PROCESS, A MICROELECTRODE ARRAY STRUCTURE AND A MICROELECTRODE ARRAY"

GENEVA, Dec. 8 -- NTT RESEARCH, INC. (940 Stewart DrSunnyvale, California 94085), TECHNISCHE UNIVERSITAT MUNCHEN (ArcisstraBe 2180333 Munchen) filed a patent application (PCT/EP2024/065068) for "A METHOD FOR MANUFACTURING A MICROELECTRODE ARRAY STRUCTURE BY A FUSED FILAMENT FABRICATION PROCESS, A MICROELECTRODE ARRAY STRUCTURE AND A MICROELECTRODE ARRAY" on May 31, 2024. With publication no. WO/2025/247503, the details related to the patent application was published on Dec 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WOLFRUM, Bernhard (HeidestraBe 28 B85716 Munchen), TESHIMA, Tetsuhik...