INTERNATIONAL PATENT: NORDSON CORPORATION FILES APPLICATION FOR "DUAL MAGNIFICATION CAMERA ASSEMBLY FOR A BOND TEST SYSTEM"

GENEVA, Dec. 9 -- NORDSON CORPORATION (28601 Clemens RoadWestlake, Ohio 44145) filed a patent application (PCT/IB2025/055599) for "DUAL MAGNIFICATION CAMERA ASSEMBLY FOR A BOND TEST SYSTEM" on May 30, 2025. With publication no. WO/2025/248497, the details related to the patent application was published on Dec 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BUGG, Martin (c/o Nordson Corporation28601 Clemens RoadWestlake, Ohio 44145)

Abstract: A bond test apparatus (100). The bond test apparatus comprises: a stage (118) for supporting a bond for testing; a test tool (148) having a test to...