INTERNATIONAL PATENT: NORDSON CORPORATION FILES APPLICATION FOR "BOND TEST APPARATUS AND METHOD"

GENEVA, Nov. 17 -- NORDSON CORPORATION (28601 Clemens RoadWestlake, Ohio 44145) filed a patent application (PCT/IB2025/054881) for "BOND TEST APPARATUS AND METHOD" on May 09, 2025. With publication no. WO/2025/233899, the details related to the patent application was published on Nov 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BUGG, Martin (c/o Nordson Corporation28601 Clemens RoadWestlake, Ohio 44145), FLETCHER, Michael (c/o Nordson Corporation28601 Clemens RoadWestlake, Ohio 44145)

Abstract: A bond test apparatus comprises: a flexure having a fixed end and a free end; a test tool,...