INTERNATIONAL PATENT: NOKIA TECHNOLOGIES OY FILES APPLICATION FOR "METHOD OF RRC CONFIGURATION STRUCTURE FOR INTER-CU LTM"

GENEVA, Oct. 13 -- NOKIA TECHNOLOGIES OY (Karakaari 702610 Espoo) filed a patent application (PCT/EP2025/058372) for "METHOD OF RRC CONFIGURATION STRUCTURE FOR INTER-CU LTM" on Mar 27, 2025. With publication no. WO/2025/209910, the details related to the patent application was published on Oct 09, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ASHRAF, Shehzad Ali (c/o Nokia Solutions and Networks GmbH & Co. KGWerinherstrasse 9181541 Munich), KHODAPANAH, Behnam (c/o Nokia Solutions and Networks GmbH & Co. KGWerinherstrasse 9181541 Munich), DOSTI, Endrit (c/o Nokia Solutions and Networks OyKa...