INTERNATIONAL PATENT: NITTO DENKO CORPORATION FILES APPLICATION FOR "THIN THERMAL INTERFACE MATERIALS AND METHODS FOR MAKING THE SAME"

GENEVA, Aug. 6 -- NITTO DENKO CORPORATION (1-1-2 Shimohozumi, Ibaraki-shi,Osaka 567-8680) filed a patent application (PCT/US2025/013269) for "THIN THERMAL INTERFACE MATERIALS AND METHODS FOR MAKING THE SAME" on Jan 27, 2025. With publication no. WO/2025/160582, the details related to the patent application was published on Jul 31, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): UENO, Kaoru (35702 Asturian WayFallbrook, CA 92028), PICENO, Josiah, Arevalo (320 Pomelo Dr.Vista, CA 92081), HAMMAKER, Jeffery (320 Pomelo Dr.Vista, CA 92081)

Abstract: The present disclosure relates to thin therm...