INTERNATIONAL PATENT: NITTO DENKO CORPORATION, 日東電工株式会社 FILES APPLICATION FOR "UPCONVERSION MATERIAL, ADHESIVE SHEET, SHEET FOR TEMPORARILY FIXING ELECTRONIC COMPONENT AND METHOD FOR PROCESSING ELECTRONIC COMPONENT USING SHEET FOR TEMPORARILY FIXING ELECTRONIC COMPONENT"

GENEVA, Oct. 5 -- NITTO DENKO CORPORATION (1-1-2, Shimohozumi, Ibaraki-shi, Osaka5678680), 日東電工株式会社 (大阪府茨木市下穂積１丁目１番２号) filed a patent application (PCT/JP2025/011663) for "UPCONVERSION MATERIAL, ADHESIVE SHEET, SHEET FOR TEMPORARILY FIXING ELECTRONIC COMPONENT, AND METHOD FOR PROCESSING ELECTRONIC COMPONENT USING SHEET FOR TEMPORARILY FIXING ELECTRONIC COMPONENT" on Mar 25, 2025. With publication no. WO/2025/205725, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classifi...