GENEVA, April 7 -- NITTO DENKO CORPORATION (1-2, Shimo-hozumi 1-chome, Ibaraki-shi, Osaka5678680), 日東電工株式会社 (大阪府茨木市下穂積１丁目１番２号) filed a patent application (PCT/JP2024/034448) for "ELECTROCONDUCTIVE RESIN COMPOSITION, ELECTROCONDUCTIVE RESIN SHEET, CONNECTED STRUCTURE, AND METHOD FOR PRODUCING CONNECTED STRUCTURE" on Sep 26, 2024. With publication no. WO/2025/070620, the details related to the patent application was published on Apr 03, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World ...