GENEVA, April 7 -- NITTO DENKO CORPORATION (1-2, Shimo-hozumi 1-chome, Ibaraki-shi, Osaka5678680), 日東電工株式会社 (大阪府茨木市下穂積１丁目１番２号) filed a patent application (PCT/JP2024/034449) for "CONDUCTIVE RESIN COMPOSITION, CONDUCTIVE RESIN SHEET, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE" on Sep 26, 2024. With publication no. WO/2025/070621, the details related to the patent application was published on Apr 03, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellec...