GENEVA, June 24 -- NISSHA CO.,LTD. (3, Mibu Hanai-cho, Nakagyo-ku, Kyoto-shi, Kyoto6048551), ＮＩＳＳＨＡ株式会社 (京都府京都市中京区壬生花井町３番地) filed a patent application (PCT/JP2024/042660) for "CONDUCTIVE SHEET AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE" on Dec 03, 2024. With publication no. WO/2025/126899, the details related to the patent application was published on Jun 19, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inven...