GENEVA, June 17 -- NISSHA CO.,LTD. (3, Mibu Hanai-cho, Nakagyo-ku, Kyoto-shi, Kyoto6048551), ＮＩＳＳＨＡ株式会社 (京都府京都市中京区壬生花井町３番地) filed a patent application (PCT/JP2024/042661) for "CONDUCTIVE SHEET, RESIN MOLDED ARTICLE AND PRODUCTION METHOD THEREFOR" on Dec 03, 2024. With publication no. WO/2025/121303, the details related to the patent application was published on Jun 12, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
In...