GENEVA, June 24 -- NIPPON PAPER INDUSTRIES CO., LTD. (4-1, Oji 1-chome, Kita-ku, Tokyo1140002), 日本製紙株式会社 (東京都北区王子１丁目４番１号) filed a patent application (PCT/JP2024/043349) for "PACKAGING BASE MATERIAL, PACKAGING MATERIAL, AND METHOD FOR MANUFACTURING PACKAGING MATERIAL" on Dec 09, 2024. With publication no. WO/2025/126991, the details related to the patent application was published on Jun 19, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): YOK...