GENEVA, Dec. 9 -- NIPPON ELECTRIC GLASS CO., LTD. (7-1, Seiran 2-chome, Otsu-shi, Shiga5208639), 日本電気硝子株式会社 (滋賀県大津市晴嵐２丁目７番１号) filed a patent application (PCT/JP2025/018212) for "SUBSTRATE FOR SEMICONDUCTOR PACKAGE, LOW-TEMPERATURE FIRED GLASS CERAMIC PLATE, AND METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR PACKAGE" on May 20, 2025. With publication no. WO/2025/249252, the details related to the patent application was published on Dec 04, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is mana...