GENEVA, April 15 -- NIKKISO CO., LTD. (20-3, Ebisu 4-chome, Shibuya-ku Tokyo1506022), 日機装株式会社 (東京都渋谷区恵比寿４丁目２０番３号) filed a patent application (PCT/JP2024/023099) for "BONDING METHOD AND BONDED STRUCTURE" on Jun 26, 2024. With publication no. WO/2025/074697, the details related to the patent application was published on Apr 10, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): SAITO Koichiro (c/o NIKKISO CO., LTD., 2-16-2, Noguchi...