GENEVA, Oct. 5 -- NHK SPRING CO., LTD. (3-10, Fukuura, Kanazawa-ku, Yokohama-shi, Kanagawa2360004), 日本発條株式会社 (神奈川県横浜市金沢区福浦３丁目１０番地) filed a patent application (PCT/JP2025/012220) for "ELECTRICALLY INSULATING RESIN COMPOSITION, SHEET-SHAPED UNCURED PRODUCT FOR INTERLAYER INSULATION, LAMINATE FOR CIRCUIT BOARD, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD" on Mar 26, 2025. With publication no. WO/2025/206042, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the Inte...