INTERNATIONAL PATENT: NEXWAFE GMBH FILES APPLICATION FOR "METHOD FOR SEPARATING A SEMICONDUCTOR WAFER FROM A LAYER STACK AND METHOD FOR PRODUCING A SEMICONDUCTOR WAFER"

GENEVA, Sept. 16 -- NEXWAFE GMBH (Hans-Bunte-Strasse 1979108 Freiburg) filed a patent application (PCT/EP2025/056362) for "METHOD FOR SEPARATING A SEMICONDUCTOR WAFER FROM A LAYER STACK AND METHOD FOR PRODUCING A SEMICONDUCTOR WAFER" on Mar 07, 2025. With publication no. WO/2025/186473, the details related to the patent application was published on Sep 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PORTILHO VESCOVI, Giuliano (c/o NexWafe GmbHHans-Bunte-Strasse 1979108 Freiburg), HEILIG, Matthias Leo (c/o NexWafe GmbHHans-Bunte-Strasse 1979108 Freiburg), HORNER, Martin (c/o NexWafe GmbHH...