INTERNATIONAL PATENT: NEXPERIA TECHNOLOGY (SHANGHAI) LTD., NEXPERIA B.V. FILES APPLICATION FOR "METHODS OF FORMING A SURFACE-MOUNTED INTEGRATED CIRCUIT PACKAGE"

GENEVA, July 7 -- NEXPERIA TECHNOLOGY (SHANGHAI) LTD. (Room 201, No. 458 Jumen RoadHuangpu District, Shanghai 200025), NEXPERIA B.V. (Jonkerbosplein 526534 AB, Nijmegen) filed a patent application (PCT/CN2023/142016) for "METHODS OF FORMING A SURFACE-MOUNTED INTEGRATED CIRCUIT PACKAGE" on Dec 26, 2023. With publication no. WO/2025/137867, the details related to the patent application was published on Jul 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LI, Yuan (No 16-1, Hainan RoadEconomic & TechnicalDevelopment ZoneWeihai, Shandong 264205), ZHANG, Dongbo (Room 404, Building 5088 ChangLe...