GENEVA, May 10 -- NEXPERIA TECHNOLOGY (SHANGHAI) LTD. (Room 201, No. 458 Jumen RoadHuangpu District, Shanghai 200025), NEXPERIA B.V. (Jonkerbosplein 52, 6534 AB, Nijmegen) filed a patent application (PCT/CN2023/129066) for "A TERMINAL STRUCTURE FOR A POWER SEMICONDUCTOR PACKAGING" on Nov 01, 2023. With publication no. WO/2025/091326, the details related to the patent application was published on May 08, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): GONG, Wei (8 Sycamore Lodge, 43 Dairyground Road, Bramhall, Stockport, SK7 2HY), HOGERL, Jurgen (Putzbrunner Str. 71 81739 Munich), SHI, Zilian...