GENEVA, Dec. 8 -- NEXPERIA B.V. (Jonkerbosplein 526534 AB Nijmegen) filed a patent application (PCT/EP2024/065114) for "DIE BONDING APPARATUS AND METHOD UTILIZING SUCH APPARATUS" on May 31, 2024. With publication no. WO/2025/247508, the details related to the patent application was published on Dec 04, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): ELTINK, Erik (Nijmegen), ABHINAND, Sai (Nijmegen), DE ROOIJ, Ruud (Nijmegen)
Abstract: Proposed are a die bonding apparatus and a method utilizing one, comprising an attach unit and a clamping unit structured to bond at least one semiconductor d...