INTERNATIONAL PATENT: NEXPERIA B.V. FILES APPLICATION FOR "A METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL AS SUCH SEMICONDUCTOR PACKAGE ASSEMBLY"

GENEVA, May 12 -- NEXPERIA B.V. (Jonkerbosplein 526534 AB Nijmegen) filed a patent application (PCT/EP2024/080865) for "A METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL AS SUCH SEMICONDUCTOR PACKAGE ASSEMBLY" on Oct 31, 2024. With publication no. WO/2025/093699, the details related to the patent application was published on May 08, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BROWN, Adam (Manchester), TING, Jia Yunn (Seremban), CHANG, Ting Wei (Seremban)

Abstract: A method for manufacturing a semiconductor package assembly, the method comprising: after a Die Attach C...