INTERNATIONAL PATENT: NEXGEN WAFER SYSTEMS PTE. LTD. FILES APPLICATION FOR "METHOD FOR CONTROLLING A WET ETCHING PROCESS"

GENEVA, Nov. 24 -- NEXGEN WAFER SYSTEMS PTE. LTD. (7030 Ang Mo Kio Avenue 5#06-28, Northstar@AMKSingapore 569880) filed a patent application (PCT/IB2025/054822) for "METHOD FOR CONTROLLING A WET ETCHING PROCESS" on May 08, 2025. With publication no. WO/2025/238488, the details related to the patent application was published on Nov 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KLEINDIENST, Christian (121 Jalan Jurong Kechil #05-23Singapur 598679), SANDRIESSER, Josef (Sportplatzstrasse 319A-9710 Feistritz an der Drau), ROS GONZALEZ, Dante (Italienerstr. 13/2/29500 Villach), ABABA DECIERD...