INTERNATIONAL PATENT: NEXGEN WAFER SYSTEMS PTE. LTD. FILES APPLICATION FOR "METHOD FOR CONTROLLING A WET ETCHING PROCESS"

GENEVA, Oct. 19 -- NEXGEN WAFER SYSTEMS PTE. LTD. (7030 Ang Mo Kio Avenue 5#06-28, Northstar@AMKSingapore 569880) filed a patent application (PCT/IB2025/053770) for "METHOD FOR CONTROLLING A WET ETCHING PROCESS" on Apr 10, 2025. With publication no. WO/2025/215573, the details related to the patent application was published on Oct 16, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HUBER, Martin (Am Platzl 5a9500 Villach), IBRAHIM, Hazem (10.-Oktober-StraBe 26a9020 Klagenfurt), SANCHEZ, Daniel (Stefan Moser StraBe 129500 Villach)

Abstract: The disclosure relates to a method (200) for contro...