INTERNATIONAL PATENT: NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO, STICHTING CHIP INTEGRATION TECHNOLOGY CENTER, TECHNISCHE UNIVERSITEIT DELFT FILES APPLICATION FOR "A DIE ATTACH SINTER MATERIAL AND METHOD"

GENEVA, March 10 -- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO (Anna van Buerenplein 12595 DA 's-Gravenhage), STICHTING CHIP INTEGRATION TECHNOLOGY CENTER (Transistorweg 5T6534 AT Nijmegen), TECHNISCHE UNIVERSITEIT DELFT (Stevinweg 12628 CN Delft) filed a patent application (PCT/NL2024/050472) for "A DIE ATTACH SINTER MATERIAL AND METHOD" on Aug 29, 2024. With publication no. WO/2025/048640, the details related to the patent application was published on Mar 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SMITS, Edsger Constant Pieter (c/o TNO / IP & Contr...