INTERNATIONAL PATENT: NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD, 华进半导体封装先导技术研发中心有限公司 FILES APPLICATION FOR "CHIP HEAT DISSIPATION STRUCTURE AND PACKAGING METHOD"

GENEVA, Feb. 1 -- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD (Huajin Semiconductor Phase 2, No. 2 Jingxian Road, Xinwu DistrictWuxi, Jiangsu 214135), 华进半导体封装先导技术研发中心有限公司 (中国江苏省无锡市新吴区景贤路2号华进半导体2期) filed a patent application (PCT/CN2025/099193) for "CHIP HEAT DISSIPATION STRUCTURE AND PACKAGING METHOD" on Jun 05, 2025. With publication no. WO/2026/021004, the details related to the patent application was published on Jan 29, 2026.

Notably, the patent application...