INTERNATIONAL PATENT: NAMICS CORPORATION, ナミックス株式会社 FILES APPLICATION FOR "LIQUID COMPRESSION MOLDING MATERIAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT"

GENEVA, Oct. 4 -- NAMICS CORPORATION (3993, Nigorikawa, Kita-ku, Niigata-shi, Niigata9503131), ナミックス株式会社 (新潟県新潟市北区濁川３９９３番地) filed a patent application (PCT/JP2024/027325) for "LIQUID COMPRESSION MOLDING MATERIAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT" on Jul 31, 2024. With publication no. WO/2025/203722, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World...