GENEVA, Oct. 19 -- NAKATANI CO., LTD (1049-57, Asazuma-cho, Kasai-shi, Hyogo6790105), 株式会社中谷製作所 (兵庫県加西市朝妻町１０４９－５７) filed a patent application (PCT/JP2024/014237) for "SENSOR-INCORPORATED MOLDED ARTICLE AND SENSOR-INCORPORATED MOLDING METHOD" on Apr 08, 2024. With publication no. WO/2025/215694, the details related to the patent application was published on Oct 16, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): NATAKANI...