GENEVA, Sept. 21 -- MYCO S.R.O. (Orli 483/1602 00 Brno) filed a patent application (PCT/CZ2025/050023) for "FILLING MATERIAL FOR PACKAGING AND PACKAGING MATERIAL PROVIDED WITH THIS FILLING MATERIAL" on Mar 13, 2025. With publication no. WO/2025/190438, the details related to the patent application was published on Sep 18, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): OSTREZI, Jan (Ujezd 844/7697 01 Kyjov), JANCA, Martin (Husova 794763 02 Zlin, Malenovice), MINARIK, David Sohaj (Vresovice 173696 48 Vresovice)
Abstract:
The invention relates to a filling material for packaging, which comp...