INTERNATIONAL PATENT: MURATA MANUFACTURING CO., LTD. FILES APPLICATION FOR "INTEGRATED CIRCUIT PACKAGES FOR FACILITATING POWER CONVERTER SYSTEMS AND METHODS"

GENEVA, July 14 -- MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-ChomeNagaokakyo-ShiKyoto 617-8555) filed a patent application (PCT/US2024/062326) for "INTEGRATED CIRCUIT PACKAGES FOR FACILITATING POWER CONVERTER SYSTEMS AND METHODS" on Dec 30, 2024. With publication no. WO/2025/147445, the details related to the patent application was published on Jul 10, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): GIULIANO, David M. (9369 Carroll Park DriveSan Diego, California 92121)

Abstract: Semiconductor packages for facilitating power converter systems and methods are provided. In one e...