INTERNATIONAL PATENT: MURATA MANUFACTURING CO., LTD., 株式会社村田製作所 FILES APPLICATION FOR "SUBSTRATE EQUIPPED WITH BUILT-IN THROUGH-CONDUCTORS"

GENEVA, March 24 -- MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto6178555), 株式会社村田製作所 (京都府長岡京市東神足１丁目１０番１号) filed a patent application (PCT/JP2024/013193) for "SUBSTRATE EQUIPPED WITH BUILT-IN THROUGH-CONDUCTORS" on Mar 29, 2024. With publication no. WO/2025/057462, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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