INTERNATIONAL PATENT: MULTISORB TECHNOLOGIES, INC. FILES APPLICATION FOR "STRUCTURE AND METHOD FOR ENVIRONMENTALLY FRIENDLY BLISTER PACKAGING"

GENEVA, Aug. 26 -- MULTISORB TECHNOLOGIES, INC. (325 Harlem RoadBuffalo, New York 14224) filed a patent application (PCT/US2025/015753) for "STRUCTURE AND METHOD FOR ENVIRONMENTALLY FRIENDLY BLISTER PACKAGING" on Feb 13, 2025. With publication no. WO/2025/174983, the details related to the patent application was published on Aug 21, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DONTULA, Narasimharao (20 Parkglen DriveHenrietta, New York 14467)

Abstract: A sustainable, environmentally-friendly structure and method for blister packaging comprising, in certain aspects, one or more active m...