INTERNATIONAL PATENT: MULTISCALE SYSTEMS, INC. FILES APPLICATION FOR "ADVANCED VACUUM-ENHANCED ORIGAMI COMPOSITE SANDWICH PANELS AND ASSEMBLY METHODS FOR OPTIMAL THERMAL PERFORMANCE"

GENEVA, May 19 -- MULTISCALE SYSTEMS, INC. (49 Canterbury St#500Worcester, MA 01610) filed a patent application (PCT/US2024/055153) for "ADVANCED VACUUM-ENHANCED ORIGAMI COMPOSITE SANDWICH PANELS AND ASSEMBLY METHODS FOR OPTIMAL THERMAL PERFORMANCE" on Nov 08, 2024. With publication no. WO/2025/101916, the details related to the patent application was published on May 15, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): EVANS, Arthur (3178 West GettysburgFresno, CA 93722), SILVERBERG, Jesse (49 Canterbury StWorcester, MA 01610)

Abstract: A vacuum insulated panel having an external skin and...