INTERNATIONAL PATENT: MPLUS CORP, 주식회사 엠플러스 FILES APPLICATION FOR "ULTRA-HIGH-SPEED DUAL CUTTING SYSTEM FOR SECONDARY BATTERY AND ULTRA-HIGH-SPEED DUAL CUTTING METHOD FOR SECONDARY BATTERY"

GENEVA, Dec. 23 -- MPLUS CORP (27, Oksansandan-ro, Oksan-myeonHeungdeok-gu,Cheongju-si,Chungcheongbuk-do 28101), 주식회사 엠플러스 (충청북도청주시 흥덕구옥산면 옥산산단로 27) filed a patent application (PCT/KR2025/007931) for "ULTRA-HIGH-SPEED DUAL CUTTING SYSTEM FOR SECONDARY BATTERY AND ULTRA-HIGH-SPEED DUAL CUTTING METHOD FOR SECONDARY BATTERY" on Jun 11, 2025. With publication no. WO/2025/258977, the details related to the patent application was published on Dec 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which ...