INTERNATIONAL PATENT: MOLEX, LLC FILES APPLICATION FOR "CONDUCTIVE INLAY GROUNDING AND SHIELDING"

GENEVA, Oct. 27 -- MOLEX, LLC (2222 Wellington CourtLisle, Illinois 60532) filed a patent application (PCT/IB2025/053658) for "CONDUCTIVE INLAY GROUNDING AND SHIELDING" on Apr 07, 2025. With publication no. WO/2025/219806, the details related to the patent application was published on Oct 23, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): JUMANI, Karan Jaiprakash (c/o Molex, LLC2222 Wellington CourtLisle, Illinois 60532), VALDES, Arturo Casares (c/o Molex, LLC2222 Wellington CourtLisle, Illinois 60532), BARDIKALAIE, Sina (c/o Molex, LLC2222 Wellington CourtLisle, Illinois 60532), AMLESHI, P...