GENEVA, June 2 -- MITSUI MINING & SMELTING CO., LTD. (1-11-1 Osaki, Shinagawa-ku, Tokyo1418584), 三井金属鉱業株式会社 (東京都品川区大崎一丁目11番1号) filed a patent application (PCT/JP2024/012754) for "SILVER-COATED COPPER POWDER, CONDUCTIVE RESIN COMPOSITION COMPRISING SAME, AND METHOD FOR PRODUCING SAME" on Mar 28, 2024. With publication no. WO/2025/109772, the details related to the patent application was published on May 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Pr...