GENEVA, Aug. 19 -- MITSUI MINING & SMELTING CO., LTD. (1-11-1 Osaki, Shinagawa-ku, Tokyo1418584), 三井金属鉱業株式会社 (東京都品川区大崎一丁目１１番１号) filed a patent application (PCT/JP2025/004186) for "METHOD FOR MANUFACTURING BONDED BODY, AND METHOD FOR BONDING BODIES TO BE BONDED" on Feb 07, 2025. With publication no. WO/2025/170058, the details related to the patent application was published on Aug 14, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WI...