GENEVA, Jan. 27 -- MITSUI KINZOKU COMPANY, LIMITED (1-11-1 Osaki, Shinagawa-ku, Tokyo1418584), 三井金属株式会社 (東京都品川区大崎一丁目１１番１号) filed a patent application (PCT/JP2025/024928) for "BONDING COMPOSITION, METHOD FOR PRODUCING BONDED STRUCTURE, AND METHOD FOR TEMPORARILY SECURING BODY TO BE BONDED" on Jul 11, 2025. With publication no. WO/2026/018783, the details related to the patent application was published on Jan 22, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Or...