INTERNATIONAL PATENT: MITSUBISHI ELECTRIC R&D CENTRE EUROPE BV, MITSUBISHI ELECTRIC CORPORATION FILES APPLICATION FOR "METHOD FOR MANUFACTURING VIAS IN MULTI-LAYERED PCB STACK AND MULTI-LAYERED PCB STACK"

GENEVA, June 3 -- MITSUBISHI ELECTRIC R&D CENTRE EUROPE BV (Capronilaan 34 SCHIPHOL RIJK AMSTERDAM1119NS), MITSUBISHI ELECTRIC CORPORATION (7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo1008310) filed a patent application (PCT/JP2024/080117) for "METHOD FOR MANUFACTURING VIAS IN MULTI-LAYERED PCB STACK, AND MULTI-LAYERED PCB STACK" on Jul 16, 2024. With publication no. WO/2025/110253, the details related to the patent application was published on May 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PERRIN Remi (35708 RENNES CEDEX 7), AHMED Ahmed Sabry Eltaher (35708 RENNES CEDEX 7)

Abstract:...