GENEVA, Oct. 27 -- MITSUBISHI ELECTRIC R&D CENTRE EUROPE BV (Capronilaan 34 Schiphol Rijk Amsterdam1119NS), MITSUBISHI ELECTRIC CORPORATION (7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo1008310) filed a patent application (PCT/JP2024/080169) for "HALF BRIDGE PCB EMBEDDED PREPACKAGE CELL WITH DECOUPLING FUNCTION" on Sep 24, 2024. With publication no. WO/2025/220281, the details related to the patent application was published on Oct 23, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): PERRIN Remi (35708 Rennes Cedex 7), LEFEVRE Guillaume (35708 Rennes Cedex 7)
Abstract: A semiconductor package (1...