GENEVA, Dec. 9 -- MITSUBISHI ELECTRIC CORPORATION (7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo1008310), 三菱電機株式会社 (東京都千代田区丸の内二丁目７番３号) filed a patent application (PCT/JP2024/020103) for "MOLD SUPPRESSION ASSISTANCE DEVICE, MOLD SUPPRESSION ASSISTANCE SYSTEM, MOLD SUPPRESSION ASSISTANCE METHOD, AND MOLD SUPPRESSION ASSISTANCE PROGRAM" on May 31, 2024. With publication no. WO/2025/248781, the details related to the patent application was published on Dec 04, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, whic...