GENEVA, Feb. 17 -- MITSUBISHI ELECTRIC CORPORATION (7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo1008310), 三菱電機株式会社 (東京都千代田区丸の内二丁目７番３号) filed a patent application (PCT/JP2024/027519) for "JOINING METHOD, METHOD FOR MANUFACTURING COOLER, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, COOLER, AND SEMICONDUCTOR DEVICE" on Aug 01, 2024. With publication no. WO/2025/033315, the details related to the patent application was published on Feb 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by th...