GENEVA, Sept. 21 -- MITSUBISHI ELECTRIC CORPORATION (7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo1008310), 三菱電機株式会社 (東京都千代田区丸の内二丁目７番３号) filed a patent application (PCT/JP2024/044796) for "DEVICE FOR MOLDING AND INSERTING INSULATION SHEET, AND METHOD FOR MOLDING AND INSERTING INSULATION SHEET" on Dec 18, 2024. With publication no. WO/2025/191958, the details related to the patent application was published on Sep 18, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Pr...