GENEVA, June 10 -- MITSUBISHI ELECTRIC CORPORATION (7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo1008310), 三菱電機株式会社 (東京都千代田区丸の内二丁目７番３号) filed a patent application (PCT/JP2023/042326) for "CIRCUIT BOARD, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE" on Nov 27, 2023. With publication no. WO/2025/115059, the details related to the patent application was published on Jun 05, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the ...