INTERNATIONAL PATENT: MIRTEC CO., LTD., 주식회사 미르기술 FILES APPLICATION FOR "APPARATUS AND METHOD FOR MEASURING THREE-DIMENSIONAL SHAPE AT HIGH SPEED BY USING HEIGHT PRE-SCANNING"

GENEVA, May 19 -- MIRTEC CO., LTD. ((SK Ventium, Dangjung-dong) 103-803, 166 Gosan-roGunpo-siGyeonggi-do 15850), 주식회사 미르기술 (경기도군포시고산로 166, 103-803 (당정동, SK벤티움)) filed a patent application (PCT/KR2023/018245) for "APPARATUS AND METHOD FOR MEASURING THREE-DIMENSIONAL SHAPE AT HIGH SPEED BY USING HEIGHT PRE-SCANNING" on Nov 14, 2023. With publication no. WO/2025/100610, the details related to the patent application was published on May 15, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intel...