INTERNATIONAL PATENT: MIMOS BERHAD FILES APPLICATION FOR "METHOD AND SYSTEM FOR IDENTIFYING WIRE BOND DEFECT OF A SEMICONDUCTOR DEVICE"

GENEVA, Sept. 30 -- MIMOS BERHAD (Technology Park Malaysia,57000 Kuala Lumpur) filed a patent application (PCT/MY2025/050015) for "METHOD AND SYSTEM FOR IDENTIFYING WIRE BOND DEFECT OF A SEMICONDUCTOR DEVICE" on Feb 28, 2025. With publication no. WO/2025/198463, the details related to the patent application was published on Sep 25, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PHOOI YEE, Lau (MIMOS BERHAD, TECHNOLOGY PARK MALAYSIA,57000 Kuala Lumpur), WONG, Chin Wee (MIMOS BERHAD, TECHNOLOGY PARK MALAYSIA,57000 Kuala Lumpur), YUEN, Shang Li (MIMOS BERHAD, TECHNOLOGY PARK MALAYSIA,57000 Kua...