GENEVA, June 24 -- MICROSOFT TECHNOLOGY LICENSING, LLC (One Microsoft WayRedmond, Washington 98052-6399) filed a patent application (PCT/US2024/055291) for "SIGNAL CONDITIONING CONNECTOR ASSEMBLY WITH THERMAL MANAGEMENT" on Nov 10, 2024. With publication no. WO/2025/128246, the details related to the patent application was published on Jun 19, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ADRIAN, Jason David (Microsoft Technology Licensing, LLCOne Microsoft WayRedmond, Washington 98052-6399)

Abstract: A signal conditioning connector assembly (50) is provided, including an enclosure (52)...