INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "VERTICALLY INTEGRATED COMPUTING AND MEMORY SYSTEMS AND ASSOCIATED DEVICES AND METHODS"

GENEVA, Jan. 20 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.O. Box 6Boise, Idaho 83707-0006) filed a patent application (PCT/US2025/036477) for "VERTICALLY INTEGRATED COMPUTING AND MEMORY SYSTEMS AND ASSOCIATED DEVICES AND METHODS" on Jul 03, 2025. With publication no. WO/2026/015395, the details related to the patent application was published on Jan 15, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YANG, Lingming (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, Idaho 83707-0006), SREERAMANENI, Raghukiran (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Bo...