INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "THREE-DIMENSIONAL INTEGRATED CIRCUITS, ELECTRONIC SYSTEMS AND METHODS OF FABRICATING A THREE-DIMENSIONAL INTEGRATED CIRCUIT"

GENEVA, Feb. 10 -- MICRON TECHNOLOGY, INC. (8000 South Federal Way, Mailstop 1-507Boise, Idaho 83707-0006) filed a patent application (PCT/US2025/037839) for "THREE-DIMENSIONAL INTEGRATED CIRCUITS, ELECTRONIC SYSTEMS, AND METHODS OF FABRICATING A THREE-DIMENSIONAL INTEGRATED CIRCUIT" on Jul 16, 2025. With publication no. WO/2026/029986, the details related to the patent application was published on Feb 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KUNG, Jason (No. 369, Section 4, Sanfong Road, Houli District, Central Taiwan Science ParkTaichung City, TA, 42152), LYU, Lihao (7F.-4, No. ...