INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "THERMAL VIAS FOR SEMICONDUCTOR COMPONENTS"

GENEVA, Oct. 20 -- MICRON TECHNOLOGY, INC. (8000 S. Federal WayBoise, Idaho 83716-9632) filed a patent application (PCT/US2025/023490) for "THERMAL VIAS FOR SEMICONDUCTOR COMPONENTS" on Apr 07, 2025. With publication no. WO/2025/217065, the details related to the patent application was published on Oct 16, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): GRIFFIN, Amy Rae (8000 S. Federal WayBoise, Idaho 83716-9632), KEETH, Brent (8000 S. Federal WayBoise, Idaho 83716-9632), TIGUE, Angela (8000 S. Federal WayBoise, Idaho 83716-9632)

Abstract: Methods, systems, and devices for thermal vias for...