INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "TECHNIQUES FOR SURFACE MODIFICATIONS DURING BONDING PROCEDURES"

GENEVA, Oct. 15 -- MICRON TECHNOLOGY, INC. (8000 S. Federal WayBoise, Idaho 83716-9632) filed a patent application (PCT/US2025/022357) for "TECHNIQUES FOR SURFACE MODIFICATIONS DURING BONDING PROCEDURES" on Mar 31, 2025. With publication no. WO/2025/212532, the details related to the patent application was published on Oct 09, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BAYLESS, Andrew M. (8000 S. Federal WayBoise, Idaho 83716-9632), MINNICH, Jeremy (8000 S. Federal WayBoise, Idaho 83716-9632)

Abstract: Methods, systems, and devices for surface modifications during bonding procedures ar...