INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "TCCD SPECIFICATION FOR SCALING BANDWIDTH ON HIGH BANDWIDTH MEMORY DEVICES AND ASSOCIATED SYSTEMS AND METHODS"

GENEVA, Nov. 25 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.o. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2025/028643) for "TCCD SPECIFICATION FOR SCALING BANDWIDTH ON HIGH BANDWIDTH MEMORY DEVICES AND ASSOCIATED SYSTEMS AND METHODS" on May 09, 2025. With publication no. WO/2025/240257, the details related to the patent application was published on Nov 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): AYYAPUREDDI, Sujeet (C/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006)

Abstract: A system-in-package (SiP) device that includes a base ...