INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "SYSTEMS AND METHODS FOR MITIGATING CRACK MEANDERING IN SEMICONDUCTOR DICING"

GENEVA, March 4 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2024/039517) for "SYSTEMS AND METHODS FOR MITIGATING CRACK MEANDERING IN SEMICONDUCTOR DICING" on Jul 25, 2024. With publication no. WO/2025/042540, the details related to the patent application was published on Feb 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): GUPTA, Vibhav (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006), WONG, Wei, Chang (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006), CHEN...